Thermo-mechanical behavior of energy diaphragm wall: Physical and numerical modelling

determination of some physical and mechanical properties red bean

چکیده: در این تحقیق، برخی خواص فیزیکی و مکانیکی لوبیا قرمز به-صورت تابعی از محتوی رطوبت بررسی شد. نتایج نشان داد که رطوبت بر خواص فیزیکی لوبیا قرمز شامل طول، عرض، ضخامت، قطر متوسط هندسی، قطر متوسط حسابی، سطح تصویر شده، حجم، چگالی توده، تخلخل، وزن هزار دانه و زاویه ی استقرار استاتیکی در سطح احتمال 1 درصد اثر معنی داری دارد. به طوری که با افزایش رطوبت از 54/7 به 12 درصد بر پایه خشک طول، عرض، ضخام...

Dry Chamber Wall Thermo-Mechanical Behavior and Lifetime under IFE Cyclic Energy Deposition

Thermo-mechanical behaviour of energy piles

Energy piles are an effective and economic means of using geothermal energy resources for heating and cooling buildings, contributing to legislative requirements for renewable energy in new construction. While such piles have been used for around 25 years with no apparent detrimental effect, there is limited understanding of their thermo-mechanical behaviour. This paper synthesises the results ...

[Article] Numerical modelling of microcracking in PV modules induced by thermo-mechanical loads

Micro-cracking in polycrystalline Silicon is a serious concern for the durability of photovoltaic (PV) modules due to the resulting electrical power-loss. In this contribution, a thermo-mechanical cohesive zone model is proposed to predict the evolution of micro-cracks under the action of mechanical and thermal loads. The classical nonlinear cohesive zone approach, used in fracture mechanics to...

Numerical analysis of thermo-mechanical behavior of indium micro-joint at cryogenic temperatures

Microelectronic packaging plays an important role in cryogenic engineering; in particular, a solder joint as interconnection, which offers a mechanical, thermal and electrical support, undergoes much larger and harsher thermal changes during its service compared with conventional customer electronic products. The impact of thermo-mechanical properties of such solder joints under cryogenic servi...